Apple is reportedly collaborating with Broadcom to develop an AI server chip, code-named Baltra, expected by 2026. This initiative aims to enhance Apple Intelligence features amid the growing demand for AI processing. The chip will be manufactured using TSMC’s advanced technology and is linked to Apple's ongoing Project ACDC, which focuses on building cloud infrastructure with proprietary chips. The partnership strengthens Apple’s position in the competitive AI landscape, following recent advancements in AI features across its platforms.
