Micron Technology is investing $7 billion in a new high-bandwidth memory (HBM) assembly facility in Singapore, set to begin operations in 2026. This expansion aims to meet the surging demand for HBM3E, HBM4, and HBM4E amid the AI boom. The facility will enhance Micron's market share, currently lagging behind competitors Samsung and SK Hynix. The project will create approximately 1,400 jobs initially, potentially rising to 3,000 with future expansions.